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Manufacturing Capability |
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| Capability |
Standard (mass production) |
Leading Edge (limit production) |
R&D (proto type) |
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Products |
High layer count, HLC+HDI, Consumer HDI, Rigid flex, Heavy copper |
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Layer count |
30L | 32~40L | 52L |
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HDI structure |
1+nb+1 | 2+nb+2 | 3+nb+3, any layer |
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I/L trace/space |
3/3mil @ 1mil Cu | 2.4/2.4mil @ 1mil Cu | 2/2mil @ 1mil Cu |
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O/L trace/space |
3/3mil @ 1mil Cu | 2.4/2.4mil @ 1mil Cu | 2/2mil @ 1mil Cu |
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Max. spnl panel size |
22"x28" | 22"×29" | 22"×34" |
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Max. thickness |
250mil (HDI 150mil) | 270mil | 400mil, 180mil HLC+HDI |
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Min. drill size |
10mil | 8mil | 6mil |
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Aspect ratio (through hole) |
11 | 13 | 16 |
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laser via |
4~12mil | 3.5mil | |
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Aspect ratio (blind via) |
0.6 | 0.8 | 1.2 |
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Back drill depth tolerance |
± 6 | ± 4 | ± 3 |
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Minimum core thickness |
2mil | 1mil (ZBC) | 1mil |
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HDI build up material |
Prepreg, RCC, | 2 ply prepreg | |
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Thermount | ||
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Laminates |
Dicy/Phenolic(MTg, HTg) | Nelco-13 | Taconic RF-35 |
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Halogen free | Rogers 4000 series | High speed materials |
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Polyimide (FPC) | BT | 408HR, Megtron 4/6 |
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FR408 | R1566 | |
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Controlled impedance |
Single/Differential +/-10% | Single/Differential +/- 7.5% | |
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Copper weights |
1/3 – 4 oz | 5 oz | 6 oz |
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Surface finishes |
Immersion gold, OSP | Lead free HASL | |
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Immersion silver | Mixed. Surface finish | |
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Immersion Tin | ||
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Gold finger, HASL | ||
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Buried resistance |
Ohmega ply, Asahi EPD | ||
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Buried capacitance |
ZBC 2000 | HK04, FaraFlex | |
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Filled plating via |
A/R 0.6 | A/R 0.8 | |
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®2003, Gold Circuit Electronics. All Rights Reserved.